Dual Line Laser System
Dual Line Laser System

Dual Line c-Si Laser System

​Laser System for the Photovoltaics Industry

The Dual Line c-Si™ laser processing for applications as PERC processing, laser fired contact, selective emitter doping, metal wrap through cell (MWT) drilling and scribing of edge isolation/cutting of wafers. The Dual Line c-Si™ laser processing system has already been installed at multiple leading PV manufacturer’s facilities worldwide that are focused on solar cell efficiency gains and higher productivity with low production costs.

The core of the machine is a granite base to support high precision laser optics and rapid wafer handling units. Features are a standardized HMI software and a powerful PLC system allowing a throughput range of 1800 – 3600 wafers per hour.

Options

  • Quality control system and sensors
  • MES host interface
  • OTF (on the fly processing)
    • Inline, cassette or coin stack handling for all common standards and degrees of automation

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Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


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