Laser System for the Photovoltaics Industry
The Dual Line c-Si™ laser processing for applications as PERC processing, laser fired contact, selective emitter doping, metal wrap through cell (MWT) drilling and scribing of edge isolation/cutting of wafers. The Dual Line c-Si™ laser processing system has already been installed at multiple leading PV manufacturer’s facilities worldwide that are focused on solar cell efficiency gains and higher productivity with low production costs.
The core of the machine is a granite base to support high precision laser optics and rapid wafer handling units. Features are a standardized HMI software and a powerful PLC system allowing a throughput range of 1800 – 3600 wafers per hour.