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PowerLine AVIA NX

PowerLine AVIA NX

High-power UV Laser Sub-System for High Throughput Wafer, PCB and IC Package Cutting

Powerful UV laser solution for Microelectronics and other ultraprecision manufacturing environments

The Coherent PowerLine AVIA NX combines a 40 Watt, solid-state, ultraviolet (UV) laser and precision scan optics to deliver rapid throughput, and superior quality cutting and scribing of a variety of microelectronics materials, including SIPs, packages and PCBs. The scan optics can have a field of view large enough to cover a 300 mm wafer or PCB, and the system produces fine features and narrow cuts with minimal heat affected zone (HAZ).

The PowerLine AVIA NX is a Class IV laser sub-system which mates a 40 Watt AVIA NX laser source with a two axis galvanometer deflector, a beam expander and an f-theta scan lens. This combination produces small focused spot sizes at the work surface, with high positional accuracy and stability, resulting in the ability to quickly and consistently create fine features and narrow cuts with minimal heat affected zone (HAZ).

The PowerLine AVIA NX is also designed and built to deliver exceptional reliability and longevity. The laser leverages Coherent’s extensive expertise with high-power UV sources to deliver unmatched lifetime. This laser and other system components are all contained in a sealed enclosure which utilizes filtered, recirculated air to minimize contamination from external sources. When service is required, most operations can be performed in the field, without returning the unit to the factory. This is simplified through the use of modular design, where any element of the sub-system can be removed for service or replacement without exposing the rest of the system to contamination.

Coherent can supply extensive applications support for pre-sales “proof-of-principle” and process recipe development. Once in service, all system parameters can be easily varied and optimized for a specific task by the user via its Window 10 IoT based software.

Applications

Application

Wafer Scribing
Laser Lift-Off
Flex PCB drilling & cutting
IC Package singulation

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Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


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